Reflow Soldering System
Batch oven RP 6
With the compact dimensions of the
RP 6, a max. PCB size of 300x200 mm and its low power consumption it
is capable of sample manufacturing, manufacturing of small series or
also component qualification. The heating chamber is working with a
mix of radiation heat by IR heaters and convection heat via
radiators.
| System
data |
| dimensions |
750 x 650
x 440 mm dxwxh |
| Depth (opened) |
1000 mm |
| Weight |
approx. 50
kg |
| Min. PCB
size |
10 x 10 mm |
| Max. PCB
size |
200 x 300
mm |
| Varnish |
RAL
7001/7047 |
| Max.
reflow temperature |
280 - 300
°C |
| PCB
cooling |
2x fans
continuously adjustable |
| Continuous
sound pressure level |
< 70dB (A) |
|
Download
Brochure in PDF
 |
|
